MediaTek Dimensity 6080 vs HiSilicon Kirin 970. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 가족
  Mediatek Dimensity HiSilicon Kirin
• CPU 그룹
  MediaTek Dimensity 6000 HiSilicon Kirin 970
• 세그먼트
  Mobile Mobile
• 세대
  0 6

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• 오버클러킹
  아니요 아니요

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  ARM Mali-G57 MP2 ARM Mali-G72 MP12
• GPU frequency
  0.01 GHz 0.75 GHz
• GPU (Turbo)
  터보 없음 터보 없음
• 실행 단위
  2 12
• Shader
  32 192
• Max. GPU Memory
  4 GB 2 GB
• Max. displays
  2 1
• 세대
  Vallhall 1 Bifrost 2
• 기술
  7 nm 16 nm
• 릴리스 날짜
  Q2/2020 Q3/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode 아니요
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 970 그리고 MediaTek Dimensity 6080. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-2133 LPDDR4X-2133
• 최대. Memory
  8 GB
• 메모리 채널
  2 (Dual Channel) 4
• ECC
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 6080 그리고 HiSilicon Kirin 970 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 6080 그리고 HiSilicon Kirin 970, including virtual machine technologies and fabrication processes.

• 기술
  7 nm 10 nm
• 소켓
  -- N/A
• L3-Cache
  -- 2.00 MB
• 아키텍처
  Cortex-A76 / Cortex-A55 Cortex-A73 / Cortex-A53
• 가상화
  None None
• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 릴리스 날짜
  Q1/2023 Q3/2017