MediaTek Dimensity 6080 vs HiSilicon Kirin 970. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Mediatek Dimensity HiSilicon Kirin
• CPU group
  MediaTek Dimensity 6000 HiSilicon Kirin 970
• Segment
  Mobile Mobile
• Generation
  0 6

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G57 MP2 ARM Mali-G72 MP12
• GPU frequency
  0.01 GHz 0.75 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  2 12
• Shader
  32 192
• Max. GPU Memory
  4 GB 2 GB
• Max. displays
  2 1
• Generation
  Vallhall 1 Bifrost 2
• Technology
  7 nm 16 nm
• Release date
  Q2/2020 Q3/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 970 and MediaTek Dimensity 6080. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memory
  8 GB
• Memory channels
  2 (Dual Channel) 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 6080 and HiSilicon Kirin 970 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 6080 and HiSilicon Kirin 970, including virtual machine technologies and fabrication processes.

• Technology
  7 nm 10 nm
• Socket
  -- N/A
• L3-Cache
  -- 2.00 MB
• Architecture
  Cortex-A76 / Cortex-A55 Cortex-A73 / Cortex-A53
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Release date
  Q1/2023 Q3/2017