Intel Atom x7-Z8700 contre HiSilicon Kirin 925. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  Intel Atom HiSilicon Kirin
• Génération
  1 2
• Groupe de CPU
  Intel Atom x3/x5/x7 HiSilicon Kirin 920

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.60 GHz 1.30 GHz
• Cœurs de CPU
  4 8
• Turbo (1 cœur)
  2.40 GHz 1.80 GHz
• Fils de processeur
  4 8
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  normal hybrid (big.LITTLE)
• A core
  -- 4x Cortex-A15
• B core
  -- 4x Cortex-A7

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Intel HD Graphics 405 (16EU) ARM Mali-T628 MP4
• GPU frequency
  0.20 GHz 0.60 GHz
• GPU (Turbo)
  0.60 GHz 0.60 GHz
• Unités d'exécution
  16 4
• Shader
  128 64
• Max. GPU Memory
  8 GB --
• Max. displays
  3 1
• Génération
  8 Midgard 2
• DirectX Version
  12 11
• Processus technologique
  14 nm 32nm
• Date de sortie
  Q2/2015 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Non
• h265 / HEVC (10 bit)
  Non Non
• h264
  Decode / Encode Decode / Encode
• VP9
  Non Non
• VP8
  Decode Decode / Encode
• AV1
  Non Non
• AVC
  Decode / Encode Non
• VC-1
  Decode Non
• JPEG
  Decode Non

Overview of the types and quantities of RAM supported by HiSilicon Kirin 925 et Intel Atom x7-Z8700. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3-1600 LPDDR3-1600
• ECC
  Non Non
• Canaux de mémoire
  2 2
• Version PCIe
  2.0
• Couloirs PCIe
  2

• AES-NI
  Oui Non

Analyze the TDP (Thermal Design Power) requirements of Intel Atom x7-Z8700 et HiSilicon Kirin 925 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  2 W

Information on architecture, interfaces, and additional instructions supported by Intel Atom x7-Z8700 et HiSilicon Kirin 925, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  x86-64 (64 bit) ARMv7-A32 (32 bit)
• Virtualization
  VT-x, VT-x EPT None
• Extensions ISA
  SSE4.1, SSE4.2
• L3-Cache
  2.00 MB --
• Architecture
  Cherry Trail Cortex-A15 / Cortex-A7
• Processus technologique
  14 nm 28 nm
• Socket
  BGA 138 N/A
• Date de sortie
  Q1/2015 Q3/2014