Intel Atom x7-Z8700 vs HiSilicon Kirin 925. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  Intel Atom HiSilicon Kirin
• Generation
  1 2
• CPU group
  Intel Atom x3/x5/x7 HiSilicon Kirin 920

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  1.60 GHz 1.30 GHz
• CPU Cores
  4 8
• Turbo (1 Core)
  2.40 GHz 1.80 GHz
• CPU Threads
  4 8
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  normal hybrid (big.LITTLE)
• A core
  -- 4x Cortex-A15
• B core
  -- 4x Cortex-A7

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  Intel HD Graphics 405 (16EU) ARM Mali-T628 MP4
• GPU frequency
  0.20 GHz 0.60 GHz
• GPU (Turbo)
  0.60 GHz 0.60 GHz
• Execution units
  16 4
• Shader
  128 64
• Max. GPU Memory
  8 GB --
• Max. displays
  3 1
• Generation
  8 Midgard 2
• DirectX Version
  12 11
• Technology
  14 nm 32nm
• Release date
  Q2/2015 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  Decode / Encode Decode / Encode
• VP9
  No No
• VP8
  Decode Decode / Encode
• AV1
  No No
• AVC
  Decode / Encode No
• VC-1
  Decode No
• JPEG
  Decode No

Overview of the types and quantities of RAM supported by HiSilicon Kirin 925 and Intel Atom x7-Z8700. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR3-1600 LPDDR3-1600
• ECC
  No No
• Memory channels
  2 2
• PCIe version
  2.0
• PCIe lanes
  2

• AES-NI
  Yes No

Analyze the TDP (Thermal Design Power) requirements of Intel Atom x7-Z8700 and HiSilicon Kirin 925 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  2 W

Information on architecture, interfaces, and additional instructions supported by Intel Atom x7-Z8700 and HiSilicon Kirin 925, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  x86-64 (64 bit) ARMv7-A32 (32 bit)
• Virtualization
  VT-x, VT-x EPT None
• ISA extensions
  SSE4.1, SSE4.2
• L3-Cache
  2.00 MB --
• Architecture
  Cherry Trail Cortex-A15 / Cortex-A7
• Technology
  14 nm 28 nm
• Socket
  BGA 138 N/A
• Release date
  Q1/2015 Q3/2014