Intel Atom x7-Z8700 contra HiSilicon Kirin 925. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  Intel Atom HiSilicon Kirin
• Generación
  1 2
• Grupo CPU
  Intel Atom x3/x5/x7 HiSilicon Kirin 920

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.60 GHz 1.30 GHz
• Núcleos de CPU
  4 8
• Turbo (1 núcleo)
  2.40 GHz 1.80 GHz
• Hilos de la CPU
  4 8
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  normal hybrid (big.LITTLE)
• A core
  -- 4x Cortex-A15
• B core
  -- 4x Cortex-A7

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  Intel HD Graphics 405 (16EU) ARM Mali-T628 MP4
• GPU frequency
  0.20 GHz 0.60 GHz
• GPU (Turbo)
  0.60 GHz 0.60 GHz
• Unidades de ejecución
  16 4
• Shader
  128 64
• Max. GPU Memory
  8 GB --
• Max. displays
  3 1
• Generación
  8 Midgard 2
• DirectX Version
  12 11
• Proceso técnico
  14 nm 32nm
• Fecha de publicación
  Q2/2015 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  Decode / Encode Decode / Encode
• VP9
  No No
• VP8
  Decode Decode / Encode
• AV1
  No No
• AVC
  Decode / Encode No
• VC-1
  Decode No
• JPEG
  Decode No

Overview of the types and quantities of RAM supported by HiSilicon Kirin 925 y Intel Atom x7-Z8700. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3-1600 LPDDR3-1600
• ECC
  No No
• Canales de memoria
  2 2
• Versión PCIe
  2.0
• Carriles PCIe
  2

• AES-NI
  Sí No

Analyze the TDP (Thermal Design Power) requirements of Intel Atom x7-Z8700 y HiSilicon Kirin 925 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  2 W

Information on architecture, interfaces, and additional instructions supported by Intel Atom x7-Z8700 y HiSilicon Kirin 925, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  x86-64 (64 bit) ARMv7-A32 (32 bit)
• Virtualización
  VT-x, VT-x EPT None
• Extensiones ISA
  SSE4.1, SSE4.2
• L3-Cache
  2.00 MB --
• Arquitectura
  Cherry Trail Cortex-A15 / Cortex-A7
• Proceso técnico
  14 nm 28 nm
• Enchufe
  BGA 138 N/A
• Fecha de publicación
  Q1/2015 Q3/2014