AMD A4-1200 contra HiSilicon Kirin 9000. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  AMD A HiSilicon Kirin
• Generación
  7 9
• Grupo CPU
  AMD A4-1000 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.00 GHz 2.05 GHz
• Núcleos de CPU
  2 8
• Turbo (1 núcleo)
  sin turbo 3.13 GHz
• Hilos de la CPU
  2 8
• Hyperthreading
  No No
• Overclocking
  Sí No
• Arquitectura del núcleo
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  AMD Radeon HD 8180 ARM Mali-G78 MP24
• GPU frequency
  0.23 GHz 0.76 GHz
• GPU (Turbo)
  sin turbo sin turbo
• Unidades de ejecución
  2 24
• Shader
  128 384
• Max. GPU Memory
  2 GB --
• Max. displays
  2 1
• Generación
  5 Vallhall 2
• DirectX Version
  11.1 12
• Proceso técnico
  28 nm 5 nm
• Fecha de publicación
  Q2/2013 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000 y AMD A4-1200. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  DDR3L-1066 SO-DIMM LPDDR4X-2133LPDDR5-2750
• ECC
  No No
• Canales de memoria
  2 4

• AES-NI
  Sí No

Analyze the TDP (Thermal Design Power) requirements of AMD A4-1200 y HiSilicon Kirin 9000 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  3.9 W

Information on architecture, interfaces, and additional instructions supported by AMD A4-1200 y HiSilicon Kirin 9000, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualización
  AMD-V None
• Extensiones ISA
  SSE4a, SSE4.1, SSE4.2, AVX, FMA3, FMA4
• L3-Cache
  1.00 MB --
• Arquitectura
  Temash (Jaguar) Cortex-A77 / Cortex-A55
• Proceso técnico
  28 nm 5 nm
• Enchufe
  FT3 N/A
• Fecha de publicación
  Q2/2013 Q4/2020