AMD A4-1200 gegen HiSilicon Kirin 9000. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  AMD A HiSilicon Kirin
• Generation
  7 9
• CPU Gruppe
  AMD A4-1000 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.00 GHz 2.05 GHz
• CPU Kerne
  2 8
• Turbo (1 Kern)
  kein Turbo 3.13 GHz
• CPU Threads
  2 8
• Hyperthreading
  Nein Nein
• Übertaktung
  Ja Nein
• Zentrale Architektur
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  AMD Radeon HD 8180 ARM Mali-G78 MP24
• GPU frequency
  0.23 GHz 0.76 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  2 24
• Shader
  128 384
• Max. GPU Memory
  2 GB --
• Max. displays
  2 1
• Generation
  5 Vallhall 2
• DirectX Version
  11.1 12
• technisches verfahren
  28 nm 5 nm
• Datum der Veröffentlichung
  Q2/2013 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Decode / Encode
• h265 / HEVC (10 bit)
  Nein Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  Nein Decode / Encode
• VP8
  Nein Decode / Encode
• AV1
  Nein Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000 und AMD A4-1200. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  DDR3L-1066 SO-DIMM LPDDR4X-2133LPDDR5-2750
• ECC
  Nein Nein
• Speicherkanäle
  2 4

• AES-NI
  Ja Nein

Analyze the TDP (Thermal Design Power) requirements of AMD A4-1200 und HiSilicon Kirin 9000 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  3.9 W

Information on architecture, interfaces, and additional instructions supported by AMD A4-1200 und HiSilicon Kirin 9000, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  AMD-V None
• ISA-Erweiterungen
  SSE4a, SSE4.1, SSE4.2, AVX, FMA3, FMA4
• L3-Cache
  1.00 MB --
• Architektur
  Temash (Jaguar) Cortex-A77 / Cortex-A55
• technisches verfahren
  28 nm 5 nm
• Steckdose
  FT3 N/A
• Datum der Veröffentlichung
  Q2/2013 Q4/2020