AMD A4-1200 vs HiSilicon Kirin 9000. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  AMD A HiSilicon Kirin
• Generation
  7 9
• CPU group
  AMD A4-1000 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  1.00 GHz 2.05 GHz
• CPU Cores
  2 8
• Turbo (1 Core)
  No turbo 3.13 GHz
• CPU Threads
  2 8
• Hyperthreading
  No No
• Overclocking
  Yes No
• Core architecture
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  AMD Radeon HD 8180 ARM Mali-G78 MP24
• GPU frequency
  0.23 GHz 0.76 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  2 24
• Shader
  128 384
• Max. GPU Memory
  2 GB --
• Max. displays
  2 1
• Generation
  5 Vallhall 2
• DirectX Version
  11.1 12
• Technology
  28 nm 5 nm
• Release date
  Q2/2013 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000 and AMD A4-1200. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  DDR3L-1066 SO-DIMM LPDDR4X-2133LPDDR5-2750
• ECC
  No No
• Memory channels
  2 4

• AES-NI
  Yes No

Analyze the TDP (Thermal Design Power) requirements of AMD A4-1200 and HiSilicon Kirin 9000 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  3.9 W

Information on architecture, interfaces, and additional instructions supported by AMD A4-1200 and HiSilicon Kirin 9000, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  AMD-V None
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX, FMA3, FMA4
• L3-Cache
  1.00 MB --
• Architecture
  Temash (Jaguar) Cortex-A77 / Cortex-A55
• Technology
  28 nm 5 nm
• Socket
  FT3 N/A
• Release date
  Q2/2013 Q4/2020