Qualcomm Snapdragon 808 gegen Qualcomm Snapdragon 765. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU Gruppe
  Qualcomm Snapdragon 808/810 Qualcomm Snapdragon 760
• Segment
  Mobile Mobile
• Generation
  2 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  6 / 6 8 / 8
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A57 1x Kryo 475 Prime
• B-Core
  4x Cortex-A53 1x Kryo 475 Gold
• C-Core
  -- 6x Kryo 475 Silver
• Frequenz
  1.44 GHz 1.80 GHz
• Turbo (1 Kern)
  1.82 GHz 2.30 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 418 Qualcomm Adreno 620
• GPU frequency
  0.60 GHz 0.63 GHz
• GPU (Turbo)
  0.60 GHz kein Turbo
• Shader
  128 192
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 2
• Generation
  4 6
• Direct X
  11 12.1
• technisches verfahren
  20 nm 7 nm
• Datum der Veröffentlichung
  Q2/2014 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Nein Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Nein Decode
• VP9
  Nein Decode
• AV1
  Nein Nein
• AVC
  Nein Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 765 und Qualcomm Snapdragon 808. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3-933 LPDDR4-3733
• Max. Speicher
  8 GB
• Speicherkanäle
  2 2
• ECC
  Nein Nein
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 808 und Qualcomm Snapdragon 765 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 808 und Qualcomm Snapdragon 765, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 2.00 MB
• Architektur
  Cortex-A57 / Cortex-A53 Kryo 475
• technisches verfahren
  20 nm 7 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q3/2014 Q3/2020
• Part Number
  MSM8992 SM7250-AA