Qualcomm Snapdragon 765G gegen Qualcomm Snapdragon 765. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU Gruppe
  Qualcomm Snapdragon 760 Qualcomm Snapdragon 760
• Segment
  Mobile Mobile
• Generation
  3 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  1x Kryo 475 Prime 1x Kryo 475 Prime
• B-Core
  1x Kryo 475 Gold 1x Kryo 475 Gold
• C-Core
  6x Kryo 475 Silver 6x Kryo 475 Silver
• Frequenz
  1.80 GHz 1.80 GHz
• Turbo (1 Kern)
  2.40 GHz 2.30 GHz
• Turbo (8 Cores)
  2.20 GHz 2.20 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 620 Qualcomm Adreno 620
• GPU frequency
  0.75 GHz 0.63 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Shader
  192 192
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  6 6
• Direct X
  12.1 12.1
• technisches verfahren
  7 nm 7 nm
• Datum der Veröffentlichung
  Q2/2019 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode
• VP9
  Decode Decode
• AV1
  Nein Nein
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 765 und Qualcomm Snapdragon 765G. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4-3733 LPDDR4-3733
• Max. Speicher
  8 GB 8 GB
• Speicherkanäle
  2 2
• ECC
  Nein Nein
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 765G und Qualcomm Snapdragon 765 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W 5 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 765G und Qualcomm Snapdragon 765, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  2.00 MB 2.00 MB
• Architektur
  Kryo 475 Kryo 475
• technisches verfahren
  7 nm 7 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q3/2020 Q3/2020
• Part Number
  SM7250-AB SM7250-AA