Qualcomm Snapdragon 808 contro Qualcomm Snapdragon 765. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• Gruppo CPU
  Qualcomm Snapdragon 808/810 Qualcomm Snapdragon 760
• Segmento
  Mobile Mobile
• Generazione
  2 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  6 / 6 8 / 8
• Architettura di base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A57 1x Kryo 475 Prime
• B-Core
  4x Cortex-A53 1x Kryo 475 Gold
• C-Core
  -- 6x Kryo 475 Silver
• Frequenza
  1.44 GHz 1.80 GHz
• Turbo (1 Core)
  1.82 GHz 2.30 GHz
• Hyperthreading
  No No
• Overclock
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  Qualcomm Adreno 418 Qualcomm Adreno 620
• GPU frequency
  0.60 GHz 0.63 GHz
• GPU (Turbo)
  0.60 GHz No turbo
• Shader
  128 192
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 2
• Generazione
  4 6
• Direct X
  11 12.1
• Processo tecnico
  20 nm 7 nm
• Data di rilascio
  Q2/2014 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode
• VP9
  No Decode
• AV1
  No No
• AVC
  No Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 765 e Qualcomm Snapdragon 808. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR3-933 LPDDR4-3733
• Max. Memoria
  8 GB
• Canali di memoria
  2 2
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 808 e Qualcomm Snapdragon 765 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 808 e Qualcomm Snapdragon 765, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 2.00 MB
• Architettura
  Cortex-A57 / Cortex-A53 Kryo 475
• Processo tecnico
  20 nm 7 nm
• Virtualizzazione
  None None
• Presa
  N/A N/A
• Data di rilascio
  Q3/2014 Q3/2020
• Part Number
  MSM8992 SM7250-AA