Qualcomm Snapdragon 632 gegen HiSilicon Kirin 620. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  Qualcomm Snapdragon HiSilicon Kirin
• Generation
  6 3
• CPU Gruppe
  Qualcomm Snapdragon 632 HiSilicon Kirin 620

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.80 GHz 1.20 GHz
• CPU Kerne
  8 4
• Turbo (1 Kern)
  1.80 GHz 1.20 GHz
• CPU Threads
  8 4
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (big.LITTLE) normal
• A core
  4x Kryo 250 Gold --
• B core
  4x Kryo 250 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 506 ARM Mali-450 MP4
• GPU frequency
  0.60 GHz 0.53 GHz
• GPU (Turbo)
  0.60 GHz 0.53 GHz
• Ausführungseinheiten
  0 4
• Shader
  96 64
• Max. displays
  0 1
• Generation
  5 Utgard
• DirectX Version
  11 0
• technisches verfahren
  14 nm 28nm
• Datum der Veröffentlichung
  Q4/2015 2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Nein
• h265 / HEVC (10 bit)
  Nein Nein
• h264
  Decode / Encode Nein
• VP9
  Nein Nein
• VP8
  Nein Nein
• AV1
  Nein Nein
• AVC
  Nein Nein
• VC-1
  Decode Nein
• JPEG
  Decode / Encode Nein

Overview of the types and quantities of RAM supported by HiSilicon Kirin 620 und Qualcomm Snapdragon 632. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3 LPDDR3
• ECC
  Nein Nein
• Speicherkanäle
  2 1

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 632 und HiSilicon Kirin 620 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 632 und HiSilicon Kirin 620, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• Architektur
  Kryo 250 Cortex-A53
• technisches verfahren
  14 nm 28 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q3/2018 Q1/2015
• Part Number
  SDM632 --