HiSilicon Kirin 955 gegen HiSilicon Kirin 620. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  HiSilicon Kirin HiSilicon Kirin
• Generation
  4 3
• CPU Gruppe
  HiSilicon Kirin 950 HiSilicon Kirin 620

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.80 GHz 1.20 GHz
• CPU Kerne
  8 4
• Turbo (1 Kern)
  2.50 GHz 1.20 GHz
• CPU Threads
  8 4
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (big.LITTLE) normal
• A core
  4x Cortex-A72 --
• B core
  4x Cortex-A53 --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-T880 MP4 ARM Mali-450 MP4
• GPU frequency
  0.90 GHz 0.53 GHz
• GPU (Turbo)
  0.90 GHz 0.53 GHz
• Ausführungseinheiten
  4 4
• Shader
  64 64
• Max. displays
  2 1
• Generation
  Midgard 4 Utgard
• DirectX Version
  11 0
• technisches verfahren
  16 nm 28nm
• Datum der Veröffentlichung
  Q2/2016 2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Nein
• h265 / HEVC (10 bit)
  Decode Nein
• h264
  Decode / Encode Nein
• VP9
  Nein Nein
• VP8
  Decode / Encode Nein
• AV1
  Nein Nein
• AVC
  Nein Nein
• VC-1
  Nein Nein
• JPEG
  Decode / Encode Nein

Overview of the types and quantities of RAM supported by HiSilicon Kirin 620 und HiSilicon Kirin 955. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3LPDDR4 LPDDR3
• ECC
  Nein Nein
• Speicherkanäle
  2 1

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 955 und HiSilicon Kirin 620 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 955 und HiSilicon Kirin 620, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• Architektur
  Cortex-A72 / Cortex-A53 Cortex-A53
• technisches verfahren
  16 nm 28 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q2/2016 Q1/2015