Qualcomm Snapdragon 632 contre HiSilicon Kirin 620. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  Qualcomm Snapdragon HiSilicon Kirin
• Génération
  6 3
• Groupe de CPU
  Qualcomm Snapdragon 632 HiSilicon Kirin 620

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.80 GHz 1.20 GHz
• Cœurs de CPU
  8 4
• Turbo (1 cœur)
  1.80 GHz 1.20 GHz
• Fils de processeur
  8 4
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  hybrid (big.LITTLE) normal
• A core
  4x Kryo 250 Gold --
• B core
  4x Kryo 250 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 506 ARM Mali-450 MP4
• GPU frequency
  0.60 GHz 0.53 GHz
• GPU (Turbo)
  0.60 GHz 0.53 GHz
• Unités d'exécution
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 4
• Shader
  96 64
• Max. displays
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 1
• Génération
  5 Utgard
• DirectX Version
  11 Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système.
• Processus technologique
  14 nm 28nm
• Date de sortie
  Q4/2015 2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Non
• h265 / HEVC (10 bit)
  Non Non
• h264
  Decode / Encode Non
• VP9
  Non Non
• VP8
  Non Non
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Decode Non
• JPEG
  Decode / Encode Non

Overview of the types and quantities of RAM supported by HiSilicon Kirin 620 et Qualcomm Snapdragon 632. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3 LPDDR3
• ECC
  Non Non
• Canaux de mémoire
  2 1

• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 632 et HiSilicon Kirin 620 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 632 et HiSilicon Kirin 620, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Kryo 250 Cortex-A53
• Processus technologique
  14 nm 28 nm
• Socket
  N/A N/A
• Date de sortie
  Q3/2018 Q1/2015
• Part Number
  SDM632 --