Qualcomm Snapdragon 860 对 HiSilicon Kirin 820 5G. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  Qualcomm Snapdragon HiSilicon Kirin
• 一代人
  6 6
• CPU组
  Qualcomm Snapdragon 855/860 HiSilicon Kirin 810/820
• 过去的模式
  Qualcomm Snapdragon 855+ --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.80 GHz 1.84 GHz
• CPU核数
  8 8
• 涡轮增压 (1核)
  2.96 GHz 2.36 GHz
• CPU线程
  8 8
• Turbo (8 Cores)
  2.42 GHz 2.36 GHz
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A core
  1x Kryo 485 Prime 4x Cortex-A76
• B core
  3x Kryo 485 Gold 4x Cortex-A55
• C core
  4x Kryo 485 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 640 ARM Mali-G57 MP6
• GPU frequency
  0.25 GHz 0.85 GHz
• GPU (Turbo)
  0.68 GHz 没有涡轮增压
• 执行单位
  4 6
• 着色器
  384 96
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 2
• 一代人
  5 Vallhall 1
• DirectX Version
  12.0 12
• 技术过程
  7 nm 7 nm
• 发布日期
  Q1/2019 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  没有 Decode
• AVC
  没有 Decode / Encode
• VC-1
  没有 Decode / Encode
• JPEG
  没有 Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 820 5G 和 Qualcomm Snapdragon 860. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-2133 LPDDR4X-2133
• 最大内存
  16 GB
• ECC
  没有 没有
• 记忆通道
  4 4

• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 860 和 HiSilicon Kirin 820 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 860 和 HiSilicon Kirin 820 5G, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• L2-Cache
  2.00 MB --
• L2-Cache
  3.00 MB 2.00 MB
• 建筑学
  Kryo 485 Cortex-A76 / Cortex-A55
• 技术过程
  7 nm 7 nm
• 插座
  N/A N/A
• 发布日期
  Q1/2021 Q2/2019
• Part Number
  SM8150-AC --