Qualcomm Snapdragon 855 对 Apple A13 Bionic. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  Qualcomm Snapdragon Apple A series
• 一代人
  6 13
• CPU组
  Qualcomm Snapdragon 855/860 Apple A13
• 过去的模式
  -- Apple A12 Bionic
• Successor
  -- Apple A14 Bionic

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.80 GHz 1.80 GHz
• CPU核数
  8 6
• 涡轮增压 (1核)
  2.84 GHz 2.65 GHz
• CPU线程
  8 6
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A core
  1x Kryo 485 Prime 2x Lightning
• B core
  3x Kryo 485 Gold 4x Thunder
• C core
  4x Kryo 485 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 640 Apple A13
• GPU frequency
  0.25 GHz 1.80 GHz
• GPU (Turbo)
  0.59 GHz 2.70 GHz
• 执行单位
  4 4
• 着色器
  384 384
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 1
• 一代人
  5 10
• DirectX Version
  12.0
• 技术过程
  7 nm 7 nm
• 发布日期
  Q1/2019 Q3/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  没有 没有
• AVC
  没有 Decode
• VC-1
  没有 Decode
• JPEG
  没有 Decode / Encode

Overview of the types and quantities of RAM supported by Apple A13 Bionic 和 Qualcomm Snapdragon 855. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-4266 LPDDR4X-4266
• 最大内存
  16 GB 4 GB
• ECC
  没有 没有
• 记忆通道
  4 1

• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 855 和 Apple A13 Bionic to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 855 和 Apple A13 Bionic, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• 虚拟化
  None None
• L2-Cache
  2.00 MB 8.00 MB
• L2-Cache
  3.00 MB --
• 建筑学
  Kryo 485 A13 (Lightning / Thunder)
• 技术过程
  7 nm 7 nm
• 插座
  N/A N/A
• 发布日期
  Q4/2018 Q3/2019
• Part Number
  SM8150 --