MediaTek Helio X25 对 Qualcomm Snapdragon 610. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Mediatek Helio Qualcomm Snapdragon
• CPU组
  MediaTek Helio X20 Qualcomm Snapdragon 610
• 分段
  Mobile Mobile
• 一代人
  2 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  10 / 10 4 / 4
• 核心架构
  hybrid (Prime / big.LITTLE) normal
• A-Core
  2x Cortex-A72 --
• B-Core
  4x Cortex-A53 --
• C-Core
  4x Cortex-A53 --
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-T880 MP4 Qualcomm Adreno 405
• GPU frequency
  0.85 GHz 0.55 GHz
• GPU (Turbo)
  0.85 GHz 0.55 GHz
• 执行单位
  4 0
• 着色器
  64 48
• Max. displays
  2 0
• 一代人
  Midgard 4 4
• Direct X
  11 11
• 技术过程
  16 nm 28 nm
• 发布日期
  Q2/2016 Q1/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode 没有
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode 没有
• VP9
  没有 没有
• AV1
  没有 没有
• AVC
  没有 没有
• VC-1
  没有 Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 610 和 MediaTek Helio X25. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR3-800 LPDDR3-800
• 最大内存
  4 GB
• 记忆通道
  2 1
• ECC
  没有 没有
• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio X25 和 Qualcomm Snapdragon 610 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio X25 和 Qualcomm Snapdragon 610, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 建筑学
  Cortex-A72 / Cortex-A53 Cortex-A53
• 技术过程
  20 nm 28 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q4/2015 Q3/2014
• Part Number
  MT6797T MSM8936