MediaTek Helio X25 contro Qualcomm Snapdragon 610. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Helio Qualcomm Snapdragon
• Gruppo CPU
  MediaTek Helio X20 Qualcomm Snapdragon 610
• Segmento
  Mobile Mobile
• Generazione
  2 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  10 / 10 4 / 4
• Architettura di base
  hybrid (Prime / big.LITTLE) normal
• A-Core
  2x Cortex-A72 --
• B-Core
  4x Cortex-A53 --
• C-Core
  4x Cortex-A53 --
• Overclock
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  ARM Mali-T880 MP4 Qualcomm Adreno 405
• GPU frequency
  0.85 GHz 0.55 GHz
• GPU (Turbo)
  0.85 GHz 0.55 GHz
• Unità di esecuzione
  4 0
• Shader
  64 48
• Max. displays
  2 0
• Generazione
  Midgard 4 4
• Direct X
  11 11
• Processo tecnico
  16 nm 28 nm
• Data di rilascio
  Q2/2016 Q1/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode No
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode No
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 610 e MediaTek Helio X25. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR3-800 LPDDR3-800
• Max. Memoria
  4 GB
• Canali di memoria
  2 1
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio X25 e Qualcomm Snapdragon 610 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio X25 e Qualcomm Snapdragon 610, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architettura
  Cortex-A72 / Cortex-A53 Cortex-A53
• Processo tecnico
  20 nm 28 nm
• Virtualizzazione
  None None
• Presa
  N/A N/A
• Data di rilascio
  Q4/2015 Q3/2014
• Part Number
  MT6797T MSM8936