HiSilicon Kirin 970 对 Qualcomm Snapdragon 8cx Gen. 2. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  HiSilicon Kirin Qualcomm Snapdragon
• 一代人
  6 3
• CPU组
  HiSilicon Kirin 970 Qualcomm Snapdragon 8cx

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.84 GHz 1.80 GHz
• 涡轮增压 (1核)
  2.40 GHz 2.84 GHz
• Turbo (8 Cores)
  2.40 GHz 2.84 GHz
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-G72 MP12 Qualcomm Adreno 690
• GPU frequency
  0.75 GHz 0.25 GHz
• GPU (Turbo)
  没有涡轮增压 0.59 GHz
• 执行单位
  12 0
• 着色器
  192 0
• Max. GPU Memory
  2 GB --
• Max. displays
  1 0
• 一代人
  Bifrost 2 6
• 技术过程
  16 nm 7 nm
• 发布日期
  Q3/2017 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode / Encode
• AV1
  没有 没有
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8cx Gen. 2 和 HiSilicon Kirin 970. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-2133 LPDDR4X-2133
• 最大内存
  8 GB
• ECC
  没有 没有
• 记忆通道
  4 8

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 970 和 Qualcomm Snapdragon 8cx Gen. 2 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W 7 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 970 和 Qualcomm Snapdragon 8cx Gen. 2, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• L2-Cache
  2.00 MB 2.00 MB
• 建筑学
  Cortex-A73 / Cortex-A53 Kryo 495
• 技术过程
  10 nm 7 nm
• 插座
  N/A N/A
• 发布日期
  Q3/2017 Q4/2018