HiSilicon Kirin 970 vs Qualcomm Snapdragon 8cx Gen. 2. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  HiSilicon Kirin Qualcomm Snapdragon
• 세대
  6 3
• CPU 그룹
  HiSilicon Kirin 970 Qualcomm Snapdragon 8cx

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 빈도
  1.84 GHz 1.80 GHz
• Turbo (1 Core)
  2.40 GHz 2.84 GHz
• Turbo (8 Cores)
  2.40 GHz 2.84 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  ARM Mali-G72 MP12 Qualcomm Adreno 690
• GPU frequency
  0.75 GHz 0.25 GHz
• GPU (Turbo)
  터보 없음 0.59 GHz
• 실행 단위
  12 0
• Shader
  192 0
• Max. GPU Memory
  2 GB --
• Max. displays
  1 0
• 세대
  Bifrost 2 6
• 기술
  16 nm 7 nm
• 릴리스 날짜
  Q3/2017 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode / Encode
• AV1
  아니요 아니요
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8cx Gen. 2 그리고 HiSilicon Kirin 970. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-2133 LPDDR4X-2133
• 최대. Memory
  8 GB
• ECC
  아니요 아니요
• 메모리 채널
  4 8

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 970 그리고 Qualcomm Snapdragon 8cx Gen. 2 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W 7 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 970 그리고 Qualcomm Snapdragon 8cx Gen. 2, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 가상화
  None None
• L3-Cache
  2.00 MB 2.00 MB
• 아키텍처
  Cortex-A73 / Cortex-A53 Kryo 495
• 기술
  10 nm 7 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q3/2017 Q4/2018