HiSilicon Kirin 650
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Pontuação geral
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Lançado
Q2/2016
HiSilicon Kirin 650

Processador HiSilicon Kirin 650, especificações e padrões de referência

1826 lugar no ranking geral das CPUs!
O processador HiSilicon Kirin 650 é instalado em placas com socket N/A e opera a uma frequência de 1.70 GHz. O HiSilicon Kirin 650 possui um total de 8 núcleos. Data de lançamento: Q2/2016. TDP é . Esta análise fornece todas as especificações técnicas e dados detalhados sobre o processador HiSilicon Kirin 650. Descubra tudo para saber se o jogo ou software funcionará no HiSilicon Kirin 650.

Especificações

Dados técnicos
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segmento
    Mobile
  • Série
  • Geração
    4
  • Grupo CPU
    HiSilicon Kirin 650
  • Modelo passado
    --
  • Successor
    --
CPU Technical Specs

HiSilicon Kirin 650. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Frequência
    1.70 GHz
  • Núcleos de CPU
    8
  • Turbo (1 núcleo)
    2.00 GHz
  • Roscas de CPU
    8
  • Turbo (8 Cores)
    2.00 GHz
  • Hyperthreading
    Não
  • Overclocking
    Não
  • Arquitectura central
    hybrid (big.LITTLE)
  • A core
    4x Cortex-A53
  • B core
    4x Cortex-A53
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • Nome da GPU
    ARM Mali-T830 MP2
  • GPU frequency
    0.90 GHz
  • GPU (Turbo)
    0.90 GHz
  • Unidades de execução
    2
  • Shader
    32
  • Max. GPU Memory
    --
  • Max. displays
    2
  • Geração
    Midgard 4
  • DirectX Version
    11
  • Processo técnico
    28nm
  • Data de lançamento
    Q4/2015
Suporte de codec de hardware

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode
  • h264
    Decode / Encode
  • VP9
    Não
  • VP8
    Decode / Encode
  • AV1
    Não
  • AVC
    Não
  • VC-1
    Não
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Tipo de memória
    LPDDR3-933
  • Máx. Memória
  • ECC
    Não
  • Canais de memória
    2
  • Versão PCIe
  • Pistas PCIe
Criptografia

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Não
Consumo de energia
  • TDP (PL1)
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Temperatura máxima
    --
* ver abaixo
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Conjunto de instruções (ISA)
    ARMv8-A64 (64 bit)
  • Virtualização
    None
  • Extensões ISA
  • Кеш L2
    --
  • Кеш L3
    --
  • Arquitectura
    Cortex-A53 / Cortex-A53
  • Processo técnico
    16 nm
  • Socket
    N/A
  • Data de lançamento
    Q2/2016
  • Part Number
    --
Posições em todos os rankings

Posições comuns HiSilicon Kirin 650 CPU em padrões de referência populares, para comparação com outros modelos.

  • Geekbench 5, 64bit (Single-Core)
    1447 place
  • Geekbench 5, 64bit (Multi-Core)
    1408 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1716 place

Benchmarks

Testes de desempenho CPU

Compare the benchmark scores of HiSilicon Kirin 650 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Geekbench 5, 64bit (Single-Core)
O Geekbench 5 SC é um popular teste de desempenho transversal para processadores de secretária ou móveis que utilizam intensivamente a memória do sistema.
167
167
165
163
HiSilicon Kirin 650
Geekbench 5, 64bit (Multi-Core)
O Geekbench 5 MC é um popular teste de desempenho transversal para processadores desktop ou móveis que utilizam intensivamente a memória do sistema.
767
766
766
763
HiSilicon Kirin 650
iGPU - FP32 Performance (Single-precision GFLOPS)
O desempenho do iGPU - o GPU interno em jogos.
41
41
41
41
HiSilicon Kirin 650

Sinónimos

Processadores semelhantes em termos de desempenho.

Similar em processadores de dados técnicos com HiSilicon Kirin 650.

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Qualcomm Snapdragon 425 Ver
Intel Atom x6212RE Ver
HiSilicon Kirin 659 Ver
HiSilicon Kirin 658 Ver
HiSilicon Kirin 655 Ver

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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HiSilicon Kirin 650

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