Qualcomm Snapdragon 870 versus MediaTek Dimensity 9000 Plus. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  Qualcomm Snapdragon Mediatek Dimensity
• Geração
  7 3
• Grupo CPU
  Qualcomm Snapdragon 865/870 MediaTek Dimensity 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Overclocking
  Não Não
• Arquitectura central
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  Qualcomm Adreno 650 ARM Mali-G710 MP10
• GPU frequency
  0.25 GHz 0.90 GHz
• GPU (Turbo)
  0.67 GHz Sem turbo
• Unidades de execução
  2 10
• Shader
  512 0
• Max. displays
  1 1
• Geração
  6 Vallhall 3
• Processo técnico
  7 nm 4 nm
• Data de lançamento
  Q4/2019 Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Não Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 9000 Plus e Qualcomm Snapdragon 870. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR4X-4266LPDDR5-5500 LPDDR5-7500
• Máx. Memória
  16 GB
• ECC
  Não Não
• Canais de memória
  4 4

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 870 e MediaTek Dimensity 9000 Plus to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 870 e MediaTek Dimensity 9000 Plus, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• Virtualização
  None None
• Кеш L2
  2.00 MB --
• Кеш L3
  3.00 MB --
• Arquitectura
  Kryo 585 Cortex-X2 / -A710 / -A510
• Processo técnico
  7 nm 4 nm
• Socket
  N/A N/A
• Data de lançamento
  Q2/2021 Q3/2022
• Part Number
  SM8250-AC MT6983