Qualcomm Snapdragon 870 vs MediaTek Dimensity 9000 Plus. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Mediatek Dimensity
• Generation
  7 3
• CPU group
  Qualcomm Snapdragon 865/870 MediaTek Dimensity 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Overclocking
  No No
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  Qualcomm Adreno 650 ARM Mali-G710 MP10
• GPU frequency
  0.25 GHz 0.90 GHz
• GPU (Turbo)
  0.67 GHz No turbo
• Execution units
  2 10
• Shader
  512 0
• Max. displays
  1 1
• Generation
  6 Vallhall 3
• Technology
  7 nm 4 nm
• Release date
  Q4/2019 Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 9000 Plus and Qualcomm Snapdragon 870. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-4266LPDDR5-5500 LPDDR5-7500
• Max. Memory
  16 GB
• ECC
  No No
• Memory channels
  4 4

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 870 and MediaTek Dimensity 9000 Plus to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 870 and MediaTek Dimensity 9000 Plus, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• Virtualization
  None None
• L2-Cache
  2.00 MB --
• L3-Cache
  3.00 MB --
• Architecture
  Kryo 585 Cortex-X2 / -A710 / -A510
• Technology
  7 nm 4 nm
• Socket
  N/A N/A
• Release date
  Q2/2021 Q3/2022
• Part Number
  SM8250-AC MT6983