HiSilicon Kirin 820 5G versus Qualcomm Snapdragon 778G. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  HiSilicon Kirin Qualcomm Snapdragon
• Geração
  6 4
• Grupo CPU
  HiSilicon Kirin 810/820 Qualcomm Snapdragon 778

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequência
  1.84 GHz 1.90 GHz
• Núcleos de CPU
  8 8
• Turbo (1 núcleo)
  2.36 GHz 2.40 GHz
• Roscas de CPU
  8 8
• Turbo (8 Cores)
  2.36 GHz 2.20 GHz
• Hyperthreading
  Não Não
• Overclocking
  Não Não
• Arquitectura central
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  4x Cortex-A76 1x Kryo 670 Prime
• B core
  4x Cortex-A55 3x Kryo 670 Gold
• C core
  -- 4x Kryo 670 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  ARM Mali-G57 MP6 Qualcomm Adreno 642L
• GPU frequency
  0.85 GHz
• GPU (Turbo)
  Sem turbo Sem turbo
• Unidades de execução
  6 4
• Shader
  96 384
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 1
• Geração
  Vallhall 1 5
• DirectX Version
  12 12.0
• Processo técnico
  7 nm 6 nm
• Data de lançamento
  Q2/2020 Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Decode Não
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 778G e HiSilicon Kirin 820 5G. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR4X-2133 LPDDR4X-2133
• Máx. Memória
  16 GB
• ECC
  Não Não
• Canais de memória
  4 2

• AES-NI
  Não Não

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 820 5G e Qualcomm Snapdragon 778G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 820 5G e Qualcomm Snapdragon 778G, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualização
  None None
• Кеш L3
  2.00 MB 2.00 MB
• Arquitectura
  Cortex-A76 / Cortex-A55 Kryo 670
• Processo técnico
  7 nm 6 nm
• Socket
  N/A N/A
• Data de lançamento
  Q2/2019 Q2/2021
• Part Number
  -- SM7325