HiSilicon Kirin 820 5G vs Qualcomm Snapdragon 778G. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  HiSilicon Kirin Qualcomm Snapdragon
• 세대
  6 4
• CPU 그룹
  HiSilicon Kirin 810/820 Qualcomm Snapdragon 778

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 빈도
  1.84 GHz 1.90 GHz
• CPU 코어
  8 8
• Turbo (1 Core)
  2.36 GHz 2.40 GHz
• CPU 스레드
  8 8
• Turbo (8 Cores)
  2.36 GHz 2.20 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  4x Cortex-A76 1x Kryo 670 Prime
• B core
  4x Cortex-A55 3x Kryo 670 Gold
• C core
  -- 4x Kryo 670 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  ARM Mali-G57 MP6 Qualcomm Adreno 642L
• GPU frequency
  0.85 GHz
• GPU (Turbo)
  터보 없음 터보 없음
• 실행 단위
  6 4
• Shader
  96 384
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 1
• 세대
  Vallhall 1 5
• DirectX Version
  12 12.0
• 기술
  7 nm 6 nm
• 릴리스 날짜
  Q2/2020 Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Decode 아니요
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 778G 그리고 HiSilicon Kirin 820 5G. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-2133 LPDDR4X-2133
• 최대. Memory
  16 GB
• ECC
  아니요 아니요
• 메모리 채널
  4 2

• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 820 5G 그리고 Qualcomm Snapdragon 778G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 820 5G 그리고 Qualcomm Snapdragon 778G, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 가상화
  None None
• L3-Cache
  2.00 MB 2.00 MB
• 아키텍처
  Cortex-A76 / Cortex-A55 Kryo 670
• 기술
  7 nm 6 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q2/2019 Q2/2021
• Part Number
  -- SM7325