MediaTek Dimensity 8200
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Wynik ogólny
star star star star star
Wydany
Q4/2022
MediaTek Dimensity 8200

Procesor MediaTek Dimensity 8200, specyfikacje i wzorce

Procesor MediaTek Dimensity 8200 jest montowany w płytach z gniazdem -- i pracuje z częstotliwością 3.10 GHz. Procesor MediaTek Dimensity 8200 ma 8 / 8 rdzeni. Data wydania: Q4/2022. TDP wynosi . Ta recenzja zawiera wszystkie dane techniczne i szczegółowe informacje o procesorze MediaTek Dimensity 8200. Dowiedz się wszystkiego, aby ocenić, czy gra lub oprogramowanie będą działać na MediaTek Dimensity 8200.

Specyfikacje

Dane techniczne
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Seria
  • Grupa CPU
    MediaTek Dimensity 8000 4nm
  • Segment
    Mobile
  • Pokolenie
    3
  • Model z przeszłości
    --
  • Successor
    --
CPU Technical Specs

MediaTek Dimensity 8200. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • CPU Cores / Threads
    8 / 8
  • Architektura podstawowa
    hybrid (big.LITTLE)
  • A-Core
    1x Cortex-A78
  • B-Core
    3x Cortex-A78
  • C-Core
    4x Cortex-A55
  • Hyperthreading / SMT
    Nie
  • Overclocking
    Nie
  • A-Core Frequency
    3.10 GHz
  • B-Core Frequency
    3.00 GHz
  • C-Core Frequency
    2.00 GHz
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • Nazwa procesora graficznego
    ARM Mali-G610 MP6
  • GPU frequency
  • GPU (Turbo)
    No turbo
  • Jednostki wykonawcze
    6
  • Shader
    Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.
  • Max. GPU Memory
    --
  • Max. displays
    1
  • Pokolenie
    Vallhall 3
  • Direct X
    12
  • Proces technologiczny
    4 nm
  • Data wydania
    Q2/2021
Obsługa kodeków sprzętowych

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP8
    Decode / Encode
  • VP9
    Decode / Encode
  • AV1
    Decode
  • AVC
    Decode / Encode
  • VC-1
    Decode / Encode
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Typ pamięci
    LPDDR5-6400
  • Max. Pamięć
  • Kanały pamięci
    4 (Quad Channel)
  • Bandwidth
    51.2 GB/s
  • ECC
    Nie
  • PCIe
  • AES-NI
    Nie
Zużycie energii
  • TDP (PL1 / PBP)
  • TDP (PL2)
    --
  • TDP up
    --
  • TDP down
    --
  • Temperatura maksymalna
    --
* zob. poniżej
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Proces technologiczny
    4 nm
  • Chip design
    Chiplet
  • Gniazdo
    --
  • L2-Cache
    --
  • L3-Cache
    --
  • Architektura
    Cortex-A78 / -A78 / -A55
  • Operating systems
    Android
  • Wirtualizacja
    None
  • Zestaw instrukcji (ISA)
    ARMv8-A64 (64 bit)
  • Rozszerzenia ISA
  • Data wydania
    Q4/2022
  • Release price
    --
  • Part Number
    MT6896 / MT6896Z
  • specyfikacja
    Technical data sheet
Pozycje we wszystkich rankingach

Wspólne stanowiska MediaTek Dimensity 8200 Procesor w popularnych benchmarkach, dla porównania z innymi modelami.

No data

Benchmarki

Badania eksploatacyjne CPU

Compare the benchmark scores of MediaTek Dimensity 8200 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Synonimy

Podobne procesory pod względem wydajności.

Podobne w technicznych procesorach danych z MediaTek Dimensity 8200.

AMD A8-7600 Zobacz
AMD A9-9425 Zobacz
AMD Ryzen 9 5900H Zobacz
Intel Core i5-11300H Zobacz
Intel Core i5-7267U Zobacz
Intel Core i5-6287U Zobacz
Intel Core i5-5350H Zobacz
Intel Core i7-8705G Zobacz

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

Oceń procesor
MediaTek Dimensity 8200

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