MediaTek Dimensity 8200
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Q4/2022
MediaTek Dimensity 8200

Prozessor MediaTek Dimensity 8200, Spezifikationen und Benchmarks

Der MediaTek Dimensity 8200 Prozessor wird in -- Sockel-Platinen installiert und arbeitet mit einer Frequenz von 3.10 GHz. Der MediaTek Dimensity 8200 hat insgesamt 8 / 8 Kerne. Erscheinungsdatum: Q4/2022. TDP beträgt . Diese Übersicht bietet alle technischen Daten und detaillierten Informationen zum MediaTek Dimensity 8200 Prozessor. Erfahren Sie alles, um festzustellen, ob Spiele oder Software auf MediaTek Dimensity 8200 laufen.

Specifications

Technische Daten
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Serie
  • CPU Gruppe
    MediaTek Dimensity 8000 4nm
  • Segment
    Mobile
  • Generation
    3
  • Vergangenes Modell
    --
  • Successor
    --
CPU Technical Specs

MediaTek Dimensity 8200. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • CPU Cores / Threads
    8 / 8
  • Zentrale Architektur
    hybrid (big.LITTLE)
  • A-Core
    1x Cortex-A78
  • B-Core
    3x Cortex-A78
  • C-Core
    4x Cortex-A55
  • Hyperthreading / SMT
    Nein
  • Übertaktung
    Nein
  • A-Core Frequency
    3.10 GHz
  • B-Core Frequency
    3.00 GHz
  • C-Core Frequency
    2.00 GHz
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • GPU-Name
    ARM Mali-G610 MP6
  • GPU frequency
  • GPU (Turbo)
    kein Turbo
  • Ausführungseinheiten
    6
  • Shader
    0
  • Max. GPU Memory
    --
  • Max. displays
    1
  • Generation
    Vallhall 3
  • Direct X
    12
  • technisches verfahren
    4 nm
  • Datum der Veröffentlichung
    Q2/2021
Hardware Codec Unterstützung

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP8
    Decode / Encode
  • VP9
    Decode / Encode
  • AV1
    Decode
  • AVC
    Decode / Encode
  • VC-1
    Decode / Encode
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Speicher Typ
    LPDDR5-6400
  • Max. Speicher
  • Speicherkanäle
    4 (Quad Channel)
  • Bandwidth
    51.2 GB/s
  • ECC
    Nein
  • PCIe
  • AES-NI
    Nein
Energieverbrauch
  • TDP (PL1 / PBP)
  • TDP (PL2)
    --
  • TDP up
    --
  • TDP down
    --
  • Maximale Temperatur
    --
* siehe unten
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • technisches verfahren
    4 nm
  • Chip design
    Chiplet
  • Steckdose
    --
  • L2-Cache
    --
  • L3-Cache
    --
  • Architektur
    Cortex-A78 / -A78 / -A55
  • Operating systems
    Android
  • Virtualisierung
    None
  • Befehlssatz (ISA)
    ARMv8-A64 (64 bit)
  • ISA-Erweiterungen
  • Datum der Veröffentlichung
    Q4/2022
  • Release price
    --
  • Part Number
    MT6896 / MT6896Z
  • Spezifikation
    Technical data sheet
Positionen in allen Ranglisten

Gemeinsame Standpunkte MediaTek Dimensity 8200 CPU in gängigen Benchmarks, zum Vergleich mit anderen Modellen.

No data

Benchmarks (tests)

Leistungstests CPU

Compare the benchmark scores of MediaTek Dimensity 8200 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Synonyme

Ähnliche Prozessoren in Bezug auf die Leistung.

Ähnlich bei technischen Datenverarbeitern mit MediaTek Dimensity 8200.

AMD A8-7600 Siehe
AMD A9-9425 Siehe
AMD Ryzen 9 5900H Siehe
Intel Core i5-11300H Siehe
Intel Core i5-7267U Siehe
Intel Core i5-6287U Siehe
Intel Core i5-5350H Siehe
Intel Core i7-8705G Siehe

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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MediaTek Dimensity 8200

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