Qualcomm Snapdragon 855 Plus kontra Qualcomm Snapdragon 8c. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Qualcomm Snapdragon Qualcomm Snapdragon
• Grupa CPU
  Qualcomm Snapdragon 855/860 Qualcomm Snapdragon 8c
• Segment
  Mobile Mobile
• Pokolenie
  6 3
• Successor
  Qualcomm Snapdragon 860 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Architektura podstawowa
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  1x Kryo 485 Prime 4x Kryo 490 Gold
• B-Core
  3x Kryo 485 Gold 4x Kryo 490 Silver
• C-Core
  4x Kryo 485 Silver --
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 640 Qualcomm Adreno 675
• GPU frequency
  0.25 GHz 0.25 GHz
• GPU (Turbo)
  0.68 GHz 0.59 GHz
• Jednostki wykonawcze
  4 7
• Shader
  384 672
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 1
• Pokolenie
  5 5
• Direct X
  12.0 12.0
• Proces technologiczny
  7 nm 7 nm
• Data wydania
  Q1/2019 Q4/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• AV1
  Nie Nie
• AVC
  Nie Decode
• VC-1
  Nie Decode
• JPEG
  Nie Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8c oraz Qualcomm Snapdragon 855 Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-4266 LPDDR4X-4266
• Max. Pamięć
  16 GB 16 GB
• Kanały pamięci
  4 4
• ECC
  Nie Nie
• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 855 Plus oraz Qualcomm Snapdragon 8c to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 855 Plus oraz Qualcomm Snapdragon 8c, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2.00 MB 2.00 MB
• L3-Cache
  3.00 MB 3.00 MB
• Architektura
  Kryo 485 Kryo 490
• Proces technologiczny
  7 nm 7 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q4/2018 Q4/2019
• Part Number
  SM8150-AC --