Qualcomm Snapdragon 855 Plus 対 Qualcomm Snapdragon 8c. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPUグループ
  Qualcomm Snapdragon 855/860 Qualcomm Snapdragon 8c
• セグメント
  Mobile Mobile
• 世代
  6 3
• Successor
  Qualcomm Snapdragon 860 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• コア・アーキテクチャ
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  1x Kryo 485 Prime 4x Kryo 490 Gold
• B-Core
  3x Kryo 485 Gold 4x Kryo 490 Silver
• C-Core
  4x Kryo 485 Silver --
• オーバークロッキング
  いいえ いいえ

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 640 Qualcomm Adreno 675
• GPU frequency
  0.25 GHz 0.25 GHz
• GPU (Turbo)
  0.68 GHz 0.59 GHz
• 実行部隊
  4 7
• シェーダー
  384 672
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 1
• 世代
  5 5
• Direct X
  12.0 12.0
• ぎじゅつてきなかだい
  7 nm 7 nm
• 発売日
  Q1/2019 Q4/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• AV1
  いいえ いいえ
• AVC
  いいえ Decode
• VC-1
  いいえ Decode
• JPEG
  いいえ Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8c と Qualcomm Snapdragon 855 Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-4266 LPDDR4X-4266
• マックス メモリ
  16 GB 16 GB
• メモリーチャンネル
  4 4
• ECC
  いいえ いいえ
• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 855 Plus と Qualcomm Snapdragon 8c to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 855 Plus と Qualcomm Snapdragon 8c, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2.00 MB 2.00 MB
• L3-Cache
  3.00 MB 3.00 MB
• 建築
  Kryo 485 Kryo 490
• ぎじゅつてきなかだい
  7 nm 7 nm
• 仮想化
  None None
• ソケット
  N/A N/A
• 発売日
  Q4/2018 Q4/2019
• Part Number
  SM8150-AC --