MediaTek Helio X25 kontra Qualcomm Snapdragon 435. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Mediatek Helio Qualcomm Snapdragon
• Grupa CPU
  MediaTek Helio X20 Qualcomm Snapdragon 430
• Segment
  Mobile Mobile
• Pokolenie
  2 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  hybrid (Prime / big.LITTLE) normal
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-T880 MP4 Qualcomm Adreno 505
• GPU frequency
  0.85 GHz 0.45 GHz
• GPU (Turbo)
  0.85 GHz 0.45 GHz
• Jednostki wykonawcze
  4 Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.
• Shader
  64 48
• Max. displays
  2 Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.
• Pokolenie
  Midgard 4 5
• Proces technologiczny
  16 nm 28 nm
• Data wydania
  Q2/2016 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Nie
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Nie
• VP9
  Nie Nie
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Nie Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 435 oraz MediaTek Helio X25. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3-800 LPDDR3-800
• Max. Pamięć
  4 GB
• Kanały pamięci
  2 1
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio X25 oraz Qualcomm Snapdragon 435 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio X25 oraz Qualcomm Snapdragon 435, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architektura
  Cortex-A72 / Cortex-A53 Cortex-A53
• Proces technologiczny
  20 nm 28 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q4/2015 Q4/2016
• Part Number
  MT6797T MSM8940