MediaTek Helio X25 gegen Qualcomm Snapdragon 435. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Helio Qualcomm Snapdragon
• CPU Gruppe
  MediaTek Helio X20 Qualcomm Snapdragon 430
• Segment
  Mobile Mobile
• Generation
  2 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (Prime / big.LITTLE) normal
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-T880 MP4 Qualcomm Adreno 505
• GPU frequency
  0.85 GHz 0.45 GHz
• GPU (Turbo)
  0.85 GHz 0.45 GHz
• Ausführungseinheiten
  4 0
• Shader
  64 48
• Max. displays
  2 0
• Generation
  Midgard 4 5
• technisches verfahren
  16 nm 28 nm
• Datum der Veröffentlichung
  Q2/2016 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Nein
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Nein
• VP9
  Nein Nein
• AV1
  Nein Nein
• AVC
  Nein Nein
• VC-1
  Nein Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 435 und MediaTek Helio X25. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3-800 LPDDR3-800
• Max. Speicher
  4 GB
• Speicherkanäle
  2 1
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio X25 und Qualcomm Snapdragon 435 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio X25 und Qualcomm Snapdragon 435, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architektur
  Cortex-A72 / Cortex-A53 Cortex-A53
• technisches verfahren
  20 nm 28 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q4/2015 Q4/2016
• Part Number
  MT6797T MSM8940