HiSilicon Kirin 920 kontra Intel Atom x7-Z8750. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  HiSilicon Kirin Intel Atom
• Pokolenie
  2 1
• Grupa CPU
  HiSilicon Kirin 920 Intel Atom x3/x5/x7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.30 GHz 1.60 GHz
• Rdzenie CPU
  8 4
• Turbo (1 rdzeń)
  1.70 GHz 2.56 GHz
• CPU Threads
  8 4
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) normal
• A core
  4x Cortex-A15 --
• B core
  4x Cortex-A7 --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-T628 MP4 Intel HD Graphics 405 (16EU)
• GPU frequency
  0.60 GHz 0.20 GHz
• GPU (Turbo)
  0.60 GHz 0.60 GHz
• Jednostki wykonawcze
  4 16
• Shader
  64 128
• Max. GPU Memory
  -- 8 GB
• Max. displays
  1 3
• Pokolenie
  Midgard 2 8
• DirectX Version
  11 12
• Proces technologiczny
  32nm 14 nm
• Data wydania
  Q4/2012 Q2/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode / Encode Decode / Encode
• VP9
  Nie Nie
• VP8
  Decode / Encode Decode
• AV1
  Nie Nie
• AVC
  Nie Decode / Encode
• VC-1
  Nie Decode
• JPEG
  Nie Decode

Overview of the types and quantities of RAM supported by Intel Atom x7-Z8750 oraz HiSilicon Kirin 920. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3-1600 LPDDR3-1600
• ECC
  Nie Nie
• Kanały pamięci
  2 2
• Wersja PCIe
  2.0
• Pasma PCIe
  2

• AES-NI
  Nie Tak

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 920 oraz Intel Atom x7-Z8750 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  2 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 920 oraz Intel Atom x7-Z8750, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv7-A32 (32 bit) x86-64 (64 bit)
• Wirtualizacja
  None VT-x, VT-x EPT
• Rozszerzenia ISA
  SSE4.1, SSE4.2
• L3-Cache
  -- 2.00 MB
• Architektura
  Cortex-A15 / Cortex-A7 Cherry Trail
• Proces technologiczny
  28 nm 14 nm
• Gniazdo
  N/A BGA 138
• Data wydania
  Q3/2014 Q1/2016