HiSilicon Kirin 935 kontra HiSilicon Kirin 920. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  HiSilicon Kirin HiSilicon Kirin
• Pokolenie
  3 2
• Grupa CPU
  HiSilicon Kirin 930 HiSilicon Kirin 920

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.50 GHz 1.30 GHz
• Rdzenie CPU
  8 8
• Turbo (1 rdzeń)
  2.20 GHz 1.70 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.20 GHz 1.70 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 4x Cortex-A15
• B core
  4x Cortex-A53 4x Cortex-A7

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-T628 MP4 ARM Mali-T628 MP4
• GPU frequency
  0.68 GHz 0.60 GHz
• GPU (Turbo)
  0.68 GHz 0.60 GHz
• Jednostki wykonawcze
  4 4
• Shader
  64 64
• Max. displays
  1 1
• Pokolenie
  Midgard 2 Midgard 2
• DirectX Version
  11 11
• Proces technologiczny
  32nm 32nm
• Data wydania
  Q4/2012 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode / Encode Decode / Encode
• VP9
  Nie Nie
• VP8
  Decode / Encode Decode / Encode
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Nie Nie
• JPEG
  Nie Nie

Overview of the types and quantities of RAM supported by HiSilicon Kirin 920 oraz HiSilicon Kirin 935. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3-1600 LPDDR3-1600
• ECC
  Nie Nie
• Kanały pamięci
  2 2

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 935 oraz HiSilicon Kirin 920 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 935 oraz HiSilicon Kirin 920, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv7-A32 (32 bit)
• Wirtualizacja
  None None
• Architektura
  Cortex-A53 / Cortex-A53 Cortex-A15 / Cortex-A7
• Proces technologiczny
  28 nm 28 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q1/2015 Q3/2014