HiSilicon Kirin 920 kontra Apple A8. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  HiSilicon Kirin Apple A series
• Pokolenie
  2 8
• Grupa CPU
  HiSilicon Kirin 920 Apple A8/A8X
• Model z przeszłości
  -- Apple A7
• Successor
  -- Apple A9

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.30 GHz 1.10 GHz
• Rdzenie CPU
  8 2
• Turbo (1 rdzeń)
  1.70 GHz 1.50 GHz
• CPU Threads
  8 2
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) normal
• A core
  4x Cortex-A15 2x Typhoon
• B core
  4x Cortex-A7 --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-T628 MP4 Apple A8
• GPU frequency
  0.60 GHz 0.53 GHz
• GPU (Turbo)
  0.60 GHz No turbo
• Jednostki wykonawcze
  4 4
• Shader
  64 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 1
• Pokolenie
  Midgard 2 5
• DirectX Version
  11
• Proces technologiczny
  32nm 20 nm
• Data wydania
  Q4/2012 Q3/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode / Encode Decode
• VP9
  Nie Nie
• VP8
  Decode / Encode Nie
• AV1
  Nie Nie
• AVC
  Nie Decode
• VC-1
  Nie Decode
• JPEG
  Nie Decode / Encode

Overview of the types and quantities of RAM supported by Apple A8 oraz HiSilicon Kirin 920. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3-1600 LPDDR3-1600
• Max. Pamięć
  2 GB
• ECC
  Nie Nie
• Kanały pamięci
  2 1

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 920 oraz Apple A8 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 920 oraz Apple A8, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv7-A32 (32 bit) x86-64 (64 bit)
• Wirtualizacja
  None None
• L2-Cache
  -- 1.00 MB
• L3-Cache
  -- 4.00 MB
• Architektura
  Cortex-A15 / Cortex-A7 A8
• Proces technologiczny
  28 nm 20 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q3/2014 Q3/2014