HiSilicon Kirin 658 kontra Qualcomm Snapdragon 617. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  HiSilicon Kirin Qualcomm Snapdragon
• Pokolenie
  4 2
• Grupa CPU
  HiSilicon Kirin 650 Qualcomm Snapdragon 610

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.70 GHz 1.20 GHz
• Turbo (1 rdzeń)
  2.35 GHz 1.50 GHz
• Turbo (8 Cores)
  2.35 GHz 1.20 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-T830 MP2 Qualcomm Adreno 405
• GPU frequency
  0.90 GHz 0.55 GHz
• GPU (Turbo)
  0.90 GHz 0.55 GHz
• Jednostki wykonawcze
  2 Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.
• Shader
  32 48
• Max. displays
  2 Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.
• Pokolenie
  Midgard 4 4
• Proces technologiczny
  28nm 28 nm
• Data wydania
  Q4/2015 Q1/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Nie
• h264
  Decode / Encode Decode / Encode
• VP9
  Nie Nie
• VP8
  Decode / Encode Nie
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Nie Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 617 oraz HiSilicon Kirin 658. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3-933 LPDDR3-933
• ECC
  Nie Nie
• Kanały pamięci
  2 1

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 658 oraz Qualcomm Snapdragon 617 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 658 oraz Qualcomm Snapdragon 617, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• Architektura
  Cortex-A53 / Cortex-A53 Cortex-A53
• Proces technologiczny
  16 nm 28 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q2/2016 Q4/2015
• Part Number
  -- MSM8952