HiSilicon Kirin 658 contro Qualcomm Snapdragon 617. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin Qualcomm Snapdragon
• Generazione
  4 2
• Gruppo CPU
  HiSilicon Kirin 650 Qualcomm Snapdragon 610

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenza
  1.70 GHz 1.20 GHz
• Turbo (1 Core)
  2.35 GHz 1.50 GHz
• Turbo (8 Cores)
  2.35 GHz 1.20 GHz
• Hyperthreading
  No No
• Overclock
  No No
• Architettura di base
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  ARM Mali-T830 MP2 Qualcomm Adreno 405
• GPU frequency
  0.90 GHz 0.55 GHz
• GPU (Turbo)
  0.90 GHz 0.55 GHz
• Unità di esecuzione
  2 0
• Shader
  32 48
• Max. displays
  2 0
• Generazione
  Midgard 4 4
• Processo tecnico
  28nm 28 nm
• Data di rilascio
  Q4/2015 Q1/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode No
• h264
  Decode / Encode Decode / Encode
• VP9
  No No
• VP8
  Decode / Encode No
• AV1
  No No
• AVC
  No No
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 617 e HiSilicon Kirin 658. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR3-933 LPDDR3-933
• ECC
  No No
• Canali di memoria
  2 1

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 658 e Qualcomm Snapdragon 617 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 658 e Qualcomm Snapdragon 617, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualizzazione
  None None
• Architettura
  Cortex-A53 / Cortex-A53 Cortex-A53
• Processo tecnico
  16 nm 28 nm
• Presa
  N/A N/A
• Data di rilascio
  Q2/2016 Q4/2015
• Part Number
  -- MSM8952