HiSilicon Kirin 650 kontra Samsung Exynos 7870. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  HiSilicon Kirin Samsung Exynos
• Pokolenie
  4 1
• Grupa CPU
  HiSilicon Kirin 650 Samsung Exynos 7570/7870/7880

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.70 GHz 1.60 GHz
• Turbo (1 rdzeń)
  2.00 GHz 1.60 GHz
• Turbo (8 Cores)
  2.00 GHz 1.60 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-T830 MP2 ARM Mali-T830 MP1
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  0.90 GHz 0.60 GHz
• Jednostki wykonawcze
  2 1
• Shader
  32 16
• Max. displays
  2 2
• Pokolenie
  Midgard 4 Midgard 4
• Proces technologiczny
  28nm 28nm
• Data wydania
  Q4/2015 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Nie Nie
• VP8
  Decode / Encode Decode / Encode
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Nie Nie
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Samsung Exynos 7870 oraz HiSilicon Kirin 650. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3-933 LPDDR3-933
• ECC
  Nie Nie
• Kanały pamięci
  2 Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 650 oraz Samsung Exynos 7870 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 650 oraz Samsung Exynos 7870, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• L2-Cache
  -- 2.00 MB
• Architektura
  Cortex-A53 / Cortex-A53 Cortex-A53
• Proces technologiczny
  16 nm 14 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q2/2016 Q1/2016