MediaTek Dimensity 820 vs MediaTek Helio G25. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  Mediatek Dimensity Mediatek Helio
• 세대
  1 1
• CPU 그룹
  MediaTek Dimensity 820 MediaTek Helio G25/G35

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A76 4x Cortex-A53
• B core
  4x Cortex-A55 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  ARM Mali-G57 MP5 PowerVR GE8320
• GPU frequency
  0.90 GHz 0.65 GHz
• GPU (Turbo)
  터보 없음 터보 없음
• 실행 단위
  5 1
• Shader
  80 --
• Max. GPU Memory
  4 GB --
• Max. displays
  2 1
• 세대
  Vallhall 1 --
• DirectX Version
  12 10
• 기술
  7 nm 20 nm
• 릴리스 날짜
  Q2/2020 Q1/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode 아니요
• h265 / HEVC (10 bit)
  Decode / Encode 아니요
• h264
  Decode / Encode 아니요
• VP9
  Decode / Encode 아니요
• VP8
  Decode / Encode 아니요
• AV1
  Decode 아니요
• AVC
  Decode / Encode 아니요
• VC-1
  Decode / Encode 아니요
• JPEG
  Decode / Encode 아니요

Overview of the types and quantities of RAM supported by MediaTek Helio G25 그리고 MediaTek Dimensity 820. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-2133 LPDDR3-933LPDDR4X-1600
• 최대. Memory
  16 GB 6 GB
• ECC
  아니요 아니요
• 메모리 채널
  2 1
• PCIe 버전
  --
• PCIe 레인
  --

• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 820 그리고 MediaTek Helio G25 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 820 그리고 MediaTek Helio G25, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 가상화
  None None
• ISA 확장
  --
• 아키텍처
  Cortex-A76 / Cortex-A55 Cortex-A53 / Cortex-A53
• 기술
  7 nm 12 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q2/2020 Q2/2020
• Part Number
  MT6875 MT6762G