MediaTek Dimensity 820 vs MediaTek Helio G25. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  Mediatek Dimensity Mediatek Helio
• Generation
  1 1
• CPU group
  MediaTek Dimensity 820 MediaTek Helio G25/G35

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A76 4x Cortex-A53
• B core
  4x Cortex-A55 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G57 MP5 PowerVR GE8320
• GPU frequency
  0.90 GHz 0.65 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  5 1
• Shader
  80 --
• Max. GPU Memory
  4 GB --
• Max. displays
  2 1
• Generation
  Vallhall 1 --
• DirectX Version
  12 10
• Technology
  7 nm 20 nm
• Release date
  Q2/2020 Q1/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode No
• VP9
  Decode / Encode No
• VP8
  Decode / Encode No
• AV1
  Decode No
• AVC
  Decode / Encode No
• VC-1
  Decode / Encode No
• JPEG
  Decode / Encode No

Overview of the types and quantities of RAM supported by MediaTek Helio G25 and MediaTek Dimensity 820. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-2133 LPDDR3-933LPDDR4X-1600
• Max. Memory
  16 GB 6 GB
• ECC
  No No
• Memory channels
  2 1
• PCIe version
  --
• PCIe lanes
  --

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 820 and MediaTek Helio G25 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 820 and MediaTek Helio G25, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• ISA extensions
  --
• Architecture
  Cortex-A76 / Cortex-A55 Cortex-A53 / Cortex-A53
• Technology
  7 nm 12 nm
• Socket
  N/A N/A
• Release date
  Q2/2020 Q2/2020
• Part Number
  MT6875 MT6762G