MediaTek Dimensity 1000C vs Qualcomm Snapdragon 670. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  Mediatek Dimensity Qualcomm Snapdragon
• 세대
  1 6
• CPU 그룹
  MediaTek Dimensity 1000 Qualcomm Snapdragon 670

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 빈도
  2.00 GHz 1.70 GHz
• CPU 코어
  8 8
• Turbo (1 Core)
  2.00 GHz 2.00 GHz
• CPU 스레드
  8 8
• Turbo (8 Cores)
  2.00 GHz 1.70 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A77 2x Kryo 360 Gold
• B core
  4x Cortex-A55 6x Kryo 360 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  ARM Mali-G57 MP5 Qualcomm Adreno 615
• GPU frequency
  0.95 GHz 0.70 GHz
• GPU (Turbo)
  터보 없음 0.70 GHz
• 실행 단위
  5 0
• Shader
  80 256
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• 세대
  Vallhall 1 6
• DirectX Version
  12 12.1
• 기술
  7 nm 10 nm
• 릴리스 날짜
  Q2/2020 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Decode 아니요
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 670 그리고 MediaTek Dimensity 1000C. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-1866 LPDDR4X-1866
• 최대. Memory
  12 GB
• ECC
  아니요 아니요
• 메모리 채널
  4 2

• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 1000C 그리고 Qualcomm Snapdragon 670 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 1000C 그리고 Qualcomm Snapdragon 670, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 가상화
  None None
• 아키텍처
  Cortex-A77 / Cortex-A55 Kryo 360
• 기술
  7 nm 10 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q3/2020 Q3/2018
• Part Number
  MT6883Z/CZA SDM670