MediaTek Dimensity 1000C 対 Qualcomm Snapdragon 670. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  Mediatek Dimensity Qualcomm Snapdragon
• 世代
  1 6
• CPUグループ
  MediaTek Dimensity 1000 Qualcomm Snapdragon 670

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  2.00 GHz 1.70 GHz
• CPUコア
  8 8
• ターボ(1コア)
  2.00 GHz 2.00 GHz
• CPUスレッド
  8 8
• Turbo (8 Cores)
  2.00 GHz 1.70 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A77 2x Kryo 360 Gold
• B core
  4x Cortex-A55 6x Kryo 360 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  ARM Mali-G57 MP5 Qualcomm Adreno 615
• GPU frequency
  0.95 GHz 0.70 GHz
• GPU (Turbo)
  ターボなし 0.70 GHz
• 実行部隊
  5 0
• シェーダー
  80 256
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• 世代
  Vallhall 1 6
• DirectX Version
  12 12.1
• ぎじゅつてきなかだい
  7 nm 10 nm
• 発売日
  Q2/2020 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Decode いいえ
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 670 と MediaTek Dimensity 1000C. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-1866 LPDDR4X-1866
• マックス メモリ
  12 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  4 2

• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 1000C と Qualcomm Snapdragon 670 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 1000C と Qualcomm Snapdragon 670, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• 建築
  Cortex-A77 / Cortex-A55 Kryo 360
• ぎじゅつてきなかだい
  7 nm 10 nm
• ソケット
  N/A N/A
• 発売日
  Q3/2020 Q3/2018
• Part Number
  MT6883Z/CZA SDM670