Qualcomm Snapdragon 860 対 Qualcomm Snapdragon 460. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  Qualcomm Snapdragon Qualcomm Snapdragon
• 世代
  6 5
• CPUグループ
  Qualcomm Snapdragon 855/860 Qualcomm Snapdragon 460
• 過去のモデル
  Qualcomm Snapdragon 855+ --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  1.80 GHz 1.80 GHz
• CPUコア
  8 8
• ターボ(1コア)
  2.96 GHz 1.80 GHz
• CPUスレッド
  8 8
• Turbo (8 Cores)
  2.42 GHz 1.80 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A core
  1x Kryo 485 Prime 4x Kryo 240 Gold
• B core
  3x Kryo 485 Gold 4x Kryo 240 Silver
• C core
  4x Kryo 485 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 640 Qualcomm Adreno 610
• GPU frequency
  0.25 GHz
• GPU (Turbo)
  0.68 GHz ターボなし
• 実行部隊
  4 0
• シェーダー
  384 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 0
• 世代
  5 6
• DirectX Version
  12.0 12.1
• ぎじゅつてきなかだい
  7 nm 11 nm
• 発売日
  Q1/2019 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  いいえ いいえ
• AVC
  いいえ Decode
• VC-1
  いいえ Decode
• JPEG
  いいえ Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 460 と Qualcomm Snapdragon 860. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-2133 LPDDR3-933LPDDR4X-1866
• マックス メモリ
  16 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  4 1

• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 860 と Qualcomm Snapdragon 460 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 860 と Qualcomm Snapdragon 460, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• L2-Cache
  2.00 MB --
• L3-Cache
  3.00 MB --
• 建築
  Kryo 485 Kryo 240
• ぎじゅつてきなかだい
  7 nm 11 nm
• ソケット
  N/A N/A
• 発売日
  Q1/2021 Q1/2020
• Part Number
  SM8150-AC SM4250-AA