Qualcomm Snapdragon 860 gegen Qualcomm Snapdragon 460. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• Generation
  6 5
• CPU Gruppe
  Qualcomm Snapdragon 855/860 Qualcomm Snapdragon 460
• Vergangenes Modell
  Qualcomm Snapdragon 855+ --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.80 GHz 1.80 GHz
• CPU Kerne
  8 8
• Turbo (1 Kern)
  2.96 GHz 1.80 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.42 GHz 1.80 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A core
  1x Kryo 485 Prime 4x Kryo 240 Gold
• B core
  3x Kryo 485 Gold 4x Kryo 240 Silver
• C core
  4x Kryo 485 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 640 Qualcomm Adreno 610
• GPU frequency
  0.25 GHz
• GPU (Turbo)
  0.68 GHz kein Turbo
• Ausführungseinheiten
  4 0
• Shader
  384 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 0
• Generation
  5 6
• DirectX Version
  12.0 12.1
• technisches verfahren
  7 nm 11 nm
• Datum der Veröffentlichung
  Q1/2019 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Nein Nein
• AVC
  Nein Decode
• VC-1
  Nein Decode
• JPEG
  Nein Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 460 und Qualcomm Snapdragon 860. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-2133 LPDDR3-933LPDDR4X-1866
• Max. Speicher
  16 GB
• ECC
  Nein Nein
• Speicherkanäle
  4 1

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 860 und Qualcomm Snapdragon 460 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 860 und Qualcomm Snapdragon 460, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• L2-Cache
  2.00 MB --
• L3-Cache
  3.00 MB --
• Architektur
  Kryo 485 Kryo 240
• technisches verfahren
  7 nm 11 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q1/2021 Q1/2020
• Part Number
  SM8150-AC SM4250-AA