HiSilicon Kirin 960 対 Qualcomm Snapdragon 810 v2. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  HiSilicon Kirin Qualcomm Snapdragon
• 世代
  5 2
• CPUグループ
  HiSilicon Kirin 960 Qualcomm Snapdragon 808/810

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  1.80 GHz 1.50 GHz
• ターボ(1コア)
  2.40 GHz 2.00 GHz
• Turbo (8 Cores)
  2.40 GHz 2.00 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  ARM Mali-G71 MP8 Qualcomm Adreno 430
• GPU frequency
  0.90 GHz 0.63 GHz
• GPU (Turbo)
  ターボなし 0.63 GHz
• 実行部隊
  8 0
• シェーダー
  256 256
• Max. GPU Memory
  2 GB --
• Max. displays
  2 0
• 世代
  Bifrost 1 4
• ぎじゅつてきなかだい
  16 nm 20 nm
• 発売日
  Q2/2016 Q2/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode いいえ
• h264
  Decode / Encode Decode / Encode
• VP9
  いいえ いいえ
• VP8
  Decode / Encode いいえ
• AV1
  いいえ いいえ
• AVC
  Decode / Encode いいえ
• VC-1
  いいえ Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 810 v2 と HiSilicon Kirin 960. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4-1600 LPDDR4-1600
• マックス メモリ
  6 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  2 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 960 と Qualcomm Snapdragon 810 v2 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 960 と Qualcomm Snapdragon 810 v2, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• L3-Cache
  4.00 MB --
• 建築
  Cortex-A73 / Cortex-A53 Cortex-A57 / Cortex-A53
• ぎじゅつてきなかだい
  16 nm 20 nm
• ソケット
  N/A N/A
• 発売日
  Q4/2016 2015
• Part Number
  -- MSM8994v2