HiSilicon Kirin 960 gegen Qualcomm Snapdragon 810 v2. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  5 2
• CPU Gruppe
  HiSilicon Kirin 960 Qualcomm Snapdragon 808/810

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.80 GHz 1.50 GHz
• Turbo (1 Kern)
  2.40 GHz 2.00 GHz
• Turbo (8 Cores)
  2.40 GHz 2.00 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G71 MP8 Qualcomm Adreno 430
• GPU frequency
  0.90 GHz 0.63 GHz
• GPU (Turbo)
  kein Turbo 0.63 GHz
• Ausführungseinheiten
  8 0
• Shader
  256 256
• Max. GPU Memory
  2 GB --
• Max. displays
  2 0
• Generation
  Bifrost 1 4
• technisches verfahren
  16 nm 20 nm
• Datum der Veröffentlichung
  Q2/2016 Q2/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Nein
• h264
  Decode / Encode Decode / Encode
• VP9
  Nein Nein
• VP8
  Decode / Encode Nein
• AV1
  Nein Nein
• AVC
  Decode / Encode Nein
• VC-1
  Nein Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 810 v2 und HiSilicon Kirin 960. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4-1600 LPDDR4-1600
• Max. Speicher
  6 GB
• ECC
  Nein Nein
• Speicherkanäle
  2 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 960 und Qualcomm Snapdragon 810 v2 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 960 und Qualcomm Snapdragon 810 v2, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• L3-Cache
  4.00 MB --
• Architektur
  Cortex-A73 / Cortex-A53 Cortex-A57 / Cortex-A53
• technisches verfahren
  16 nm 20 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q4/2016 2015
• Part Number
  -- MSM8994v2