Qualcomm Snapdragon Microsoft SQ1 contro HiSilicon Kirin 820E 5G. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon HiSilicon Kirin
• Gruppo CPU
  Qualcomm Snapdragon SQ1/SQ2 HiSilicon Kirin 810/820
• Segmento
  Mobile Mobile
• Generazione
  1 6

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architettura di base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequenza
  1.80 GHz 1.84 GHz
• Turbo (1 Core)
  3.00 GHz 2.22 GHz
• Turbo (8 Cores)
  3.00 GHz 1.84 GHz
• Hyperthreading
  No No
• Overclock
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  Qualcomm Adreno 685 ARM Mali-G57 MP6
• GPU frequency
  0.25 GHz 0.85 GHz
• GPU (Turbo)
  0.65 GHz No turbo
• Unità di esecuzione
  8 6
• Shader
  1536 96
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generazione
  5 Vallhall 1
• Processo tecnico
  7 nm 7 nm
• Data di rilascio
  Q4/2018 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 820E 5G e Qualcomm Snapdragon Microsoft SQ1. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memoria
  16 GB
• Canali di memoria
  1 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon Microsoft SQ1 e HiSilicon Kirin 820E 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W 6 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon Microsoft SQ1 e HiSilicon Kirin 820E 5G, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  2.00 MB 2.00 MB
• Architettura
  Kryo 495 Cortex-A76 / Cortex-A55
• Processo tecnico
  7 nm 7 nm
• Virtualizzazione
  None None
• Presa
  N/A N/A
• Data di rilascio
  Q3/2019 Q1/2021