Qualcomm Snapdragon Microsoft SQ1 contre HiSilicon Kirin 820E 5G. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Qualcomm Snapdragon HiSilicon Kirin
• Groupe de CPU
  Qualcomm Snapdragon SQ1/SQ2 HiSilicon Kirin 810/820
• Segment
  Mobile Mobile
• Génération
  1 6

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Fréquence
  1.80 GHz 1.84 GHz
• Turbo (1 cœur)
  3.00 GHz 2.22 GHz
• Turbo (8 Cores)
  3.00 GHz 1.84 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 685 ARM Mali-G57 MP6
• GPU frequency
  0.25 GHz 0.85 GHz
• GPU (Turbo)
  0.65 GHz Pas de turbo
• Unités d'exécution
  8 6
• Shader
  1536 96
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Génération
  5 Vallhall 1
• Processus technologique
  7 nm 7 nm
• Date de sortie
  Q4/2018 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  Non Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 820E 5G et Qualcomm Snapdragon Microsoft SQ1. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4X-2133 LPDDR4X-2133
• Max. Mémoire
  16 GB
• Canaux de mémoire
  1 4
• ECC
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon Microsoft SQ1 et HiSilicon Kirin 820E 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W 6 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon Microsoft SQ1 et HiSilicon Kirin 820E 5G, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  2.00 MB 2.00 MB
• Architecture
  Kryo 495 Cortex-A76 / Cortex-A55
• Processus technologique
  7 nm 7 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Date de sortie
  Q3/2019 Q1/2021