Qualcomm Snapdragon 712 contro MediaTek Dimensity 1000C. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Mediatek Dimensity
• Gruppo CPU
  Qualcomm Snapdragon 710 MediaTek Dimensity 1000
• Segmento
  Mobile Mobile
• Generazione
  1 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architettura di base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequenza
  1.70 GHz 2.00 GHz
• Turbo (1 Core)
  2.30 GHz 2.00 GHz
• Turbo (8 Cores)
  2.30 GHz 2.00 GHz
• Hyperthreading
  No No
• Overclock
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  Qualcomm Adreno 616 ARM Mali-G57 MP5
• GPU frequency
  0.75 GHz 0.95 GHz
• GPU (Turbo)
  0.75 GHz No turbo
• Unità di esecuzione
  0 5
• Shader
  256 80
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 2
• Generazione
  6 Vallhall 1
• Processo tecnico
  10 nm 7 nm
• Data di rilascio
  Q2/2018 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 1000C e Qualcomm Snapdragon 712. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR4X-1866 LPDDR4X-1866
• Max. Memoria
  8 GB 12 GB
• Canali di memoria
  2 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 712 e MediaTek Dimensity 1000C to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 712 e MediaTek Dimensity 1000C, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architettura
  Kryo 360 Cortex-A77 / Cortex-A55
• Processo tecnico
  10 nm 7 nm
• Virtualizzazione
  None None
• Presa
  N/A N/A
• Data di rilascio
  Q1/2019 Q3/2020
• Part Number
  -- MT6883Z/CZA