Qualcomm Snapdragon 712 gegen MediaTek Dimensity 1000C. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Mediatek Dimensity
• CPU Gruppe
  Qualcomm Snapdragon 710 MediaTek Dimensity 1000
• Segment
  Mobile Mobile
• Generation
  1 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequenz
  1.70 GHz 2.00 GHz
• Turbo (1 Kern)
  2.30 GHz 2.00 GHz
• Turbo (8 Cores)
  2.30 GHz 2.00 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 616 ARM Mali-G57 MP5
• GPU frequency
  0.75 GHz 0.95 GHz
• GPU (Turbo)
  0.75 GHz kein Turbo
• Ausführungseinheiten
  0 5
• Shader
  256 80
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 2
• Generation
  6 Vallhall 1
• technisches verfahren
  10 nm 7 nm
• Datum der Veröffentlichung
  Q2/2018 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  Nein Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 1000C und Qualcomm Snapdragon 712. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-1866 LPDDR4X-1866
• Max. Speicher
  8 GB 12 GB
• Speicherkanäle
  2 4
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 712 und MediaTek Dimensity 1000C to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 712 und MediaTek Dimensity 1000C, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architektur
  Kryo 360 Cortex-A77 / Cortex-A55
• technisches verfahren
  10 nm 7 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q1/2019 Q3/2020
• Part Number
  -- MT6883Z/CZA