HiSilicon Kirin 910 contro HiSilicon Kirin 910T. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin HiSilicon Kirin
• Generazione
  1 1
• Gruppo CPU
  HiSilicon Kirin 910 HiSilicon Kirin 910

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenza
  1.60 GHz 1.80 GHz
• Core della CPU
  4 4
• Turbo (1 Core)
  1.60 GHz 1.80 GHz
• Threads della CPU
  4 4
• Turbo (4 Cores)
  1.60 GHz 1.80 GHz
• Hyperthreading
  No No
• Overclock
  No No
• Architettura di base
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  ARM Mali-450 MP4 ARM Mali-450 MP4
• GPU frequency
  0.53 GHz 0.70 GHz
• GPU (Turbo)
  0.53 GHz 0.70 GHz
• Unità di esecuzione
  4 4
• Shader
  64 64
• Max. displays
  1 1
• Generazione
  Utgard Utgard
• Processo tecnico
  28nm 28nm
• Data di rilascio
  2012 2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  No No
• VP9
  No No
• VP8
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  No No
• JPEG
  No No

Overview of the types and quantities of RAM supported by HiSilicon Kirin 910T e HiSilicon Kirin 910. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR3 LPDDR3
• ECC
  No No
• Canali di memoria
  1 1

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 910 e HiSilicon Kirin 910T to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 910 e HiSilicon Kirin 910T, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv7-A32 (32 bit) ARMv7-A32 (32 bit)
• Virtualizzazione
  None None
• Architettura
  Cortex-A9 Cortex-A9
• Processo tecnico
  28 nm 28 nm
• Presa
  N/A N/A
• Data di rilascio
  Q1/2014 Q1/2014